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| Varistor Products Surface Mount Multilayer Varistors (MLVs) > MLE Series RoHS MLE Varistor Series Description The MLE Series family of transient voltage suppression devices are based on the Littelfuse multilayer fabrication technology. These components are designed to suppress ESD events, including those specified in IEC 61000-4-2 or other standards used for Electromagnetic Compliance testing. The MLE Series is typically applied to protect integrated circuits and other components at the circuit board level operating at 18VDC, or less. Size Table Metric EIA 0402 1608 2012 1206 The MLE Series is manufactured from semiconducting ceramics and is supplied in a leadless, surface mount package. The MLE Series is compatible with modern reflow and wave soldering procedures. Littelfuse Inc. manufactures other Multilayer Series products. See the ML Series data sheet for higher energy/ peak current transient applications. See the AUML Series for automotive applications and the MLN Quad Array. For high-speed applications see the MHS Series. Features electromagnetic compliance (EMC) communications, products, medical products, hand held/ portable devices, industrial equipment, including diagnostic port protection and (IEC-61000-4-2) impedance and capacitance up to 18VM(DC) construction technology operating temp. range Applications components and circuits sensitive to ESD Transients occurring on power supplies, control and signal lines ESD events such as specified in IEC-61000-4-2 or Absolute Maximum Ratings Continuous Steady State Applied Voltage: M(DC) MLE Series ) ) A STG Units V C 18 ) (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MLE.html for current information. 31 Revision: July 16, 2009 MLE Varistor Series MLE Series The fabrication method and materials of these devices result in capacitance characteristics suitable for high frequency attenuation/low-pass filter circuit functions, thereby providing suppression and filtering in a single device. Surface Mount Multilayer Varistors (MLVs) > MLE Series Varistor Products Device Ratings and Specifications Max Continuous Working Voltage -55C to 125C (Note 1) Part Number Nominal Voltage V at 1mA DC MIN (V) MAX (V) 22 28 22 28 22 28 22 22 22 28 28 28 Performance Specifications (25C) Maximum Clamping Maximum ESD Clamp Voltage at Specified Voltage (Note 2) Current (8/20s) VC (V) 8kV Contact (V) 15kV Air (Note 4) Typical Capacitance at 1MHz (pF) VM(DC) V18MLE0402N (V) 18 18 18 18 18 18 <100 Clamp (V) <110 <110 <140 <100 <100 V18MLE1206N 1. For applications of 18VDC 2. Tested with IEC-61000-4-2 Human Body Model (HBM) discharge test circuit. 4. Corona discharge through air (represents actual ESD event). 6. Leakage current ratings are at 18 VDC A maximum. Peak Current and Energy Derating Curve Nominal Voltage Stability to Multiple ESD Impulses (8kV Contact Discharges per IEC 61000-4-2) 30 NOMINAL VOLTAGE AT 1mADC 25 20 15 10 5 0 1 10 100 CURRENT (A) 1000 10000 peak surge current and energy ratings must be reduced as shown below. 100 PERCENT OF RATED VALUE 80 60 40 20 0 -55 Figure 2 50 60 70 80 90 100 110 120 130 140 150 Figure 1 AMBIENT TEMPERATURE ( oC) Impedance (Z) vs Frequency Typical Characteristic 100 -0402 10 -0603 -0805 IMPEDANCE (Z) 1 -1206 Standby Current at Normalized Varistor Voltage and Temperature 1.2 NORMALIZED VARISTOR VOLTAGE (V) 1.0 0.8 0.6 0.4 0.2 0.0 0.0001 0.001 0.01 CURRENT (mA) 0.1 1 125O 25O 85O 0.1 0.01 10 100 1000 FREQUENCY (MHz) 10000 Figure 4 Figure 3 MLE Varistor Series 32 Revision: July 16, 2009 (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MLE.html for current information. Varistor Products Surface Mount Multilayer Varistors (MLVs) > MLE Series Device Characteristics At low current levels, the V-I curve of the multilayer transient voltage suppressor approaches a linear (ohmic) relationship and shows a temperature dependent effect. At or below the maximum working voltage, the suppressor is in a high resistance model (approaching 106 at its maximum rated working voltage). Leakage currents at maximum rated voltage are below 100 A; A. Typical Temperature Dependance of the Haracteristic 100% SUPPRESSOR VOLTAGE IN PERCENT OF Clamping Voltage Over Temperature (VC at 10A) 100 CLAMPING VOLTAGE (V) V26MLA1206 V5.5MLA1206 10 -60 T VNOM VALUE A 25 oC (%) -40 -20 0 Figure 6 Energy Absorption/Peak Current Capability Energy dissipated within the MLE is calculated by multiplying the clamping voltage, transient current and transient duration. An important advantage of the multilayer is its interdigitated electrode construction within the mass of dielectric material. This results in excellent current distribution and the peak temperature per energy absorbed is very low. The matrix of semiconducting grains combine to absorb and distribute transient energy (heat) temperature; thermal stresses and enhances device reliability. As a measure of the device capability in energy and peak current handling, the V26MLA1206A part was tested with s). At the end of the test, 10,000 pulses later, the device voltage characteristics are still well within specification. 25 10% 1E -9 1E -8 o 50o 75o 1E -7 100o 125 oC 1E -6 1E -5 1E -4 1E -3 1E -2 Figure 5 SUPPRESSOR CURRENT (ADC) Speed of Response The Multilayer Suppressor is a leadless device. Its response time is not limited by the parasitic lead inductances found in other surface mount packages. The response time of the ZN than 1ns and the MLE can clamp very fast dV/dT events such as ESD. Additionally, in "real world" applications, the associated circuit wiring is often the greatest factor effecting speed of response. Therefore, transient suppressor placement within a circuit can be considered important in certain instances. Multilayer Internal Construction FIRED CERAMIC DIELECTRIC 100 PEAK CURRENT = 150A 8/20 s DURATION, 30s BETWEEN PULSES METAL ELECTRODES METAL END TERMINATION DEPLETION REGION VOLTAGE V26MLA1206 10 0 2000 4000 6000 NUMBER OF PULSES 8000 10000 12000 DEPLETION REGION Figure 8 GRAINS Figure 7 (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MLE.html for current information. 33 Revision: July 16, 2009 MLE Varistor Series MLE Series 20 40 60 80 TEMPERATURE ( oC) 100 120 140 Surface Mount Multilayer Varistors (MLVs) > MLE Series Varistor Products Lead (Pb) Soldering Recommendations The principal techniques used for the soldering of and Wave soldering. Typical profiles are shown on the right. The recommended solder for the MLE suppressor is 230 Reflow Solder Profile Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. When using a reflow process, care should be taken to ensure that the MLE chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's Figure 9 Wave Solder Profile still necessary to ensure that any further thermal shocks printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually Figure 10 Lead-free (Pb-free) Soldering Recommendations Littelfuse offers the Nickel Barrier Termination finish for the optimum Lead-free solder performance. flux, but there is a wide selection of pastes and fluxes available with which the Nickel Barrier parts should be compatible. The reflow profile must be constrained by the maximums PREHEAT ZONE Lead-free Re-flow Profile MAXIMUM TEMPERATURE 260C 20 - 40 SECONDS WITHIN 5C RAMP RATE <3C/s 60 - 150 SEC > 217C evaluation purposes by Littelfuse, based upon industry standards and practices. There are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. 5.0 6.0 7.0 Figure 11 MLE Varistor Series 34 Revision: July 16, 2009 (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MLE.html for current information. Varistor Products Surface Mount Multilayer Varistors (MLVs) > MLE Series Product Dimensions (mm) C E B NOTE D L A W NOTE: Avoid metal runs in this area. not recommended for use in applications using Silver (Ag) epoxy paste. Dimension A B C D (max.) E L W 1206 Size IN 0.160 0.040 MM 4.06 1.02 1.80 IN 0.120 0.040 0805 Size MM IN 0.100 0603 Size MM IN 0402 Size MM 0.020 1.02 1.10 0.040 0.008 0.012 0.008 0.008 0.006 0.006 0.89 1.00 0.024 0.024 0.006 0.004 0.004 0.61 0.60 Part Numbering System V 18 MLE 1206 X X X DEVICE FAMILY Littelfuse TVSS Device MAXIMUM DC WORKING VOLTAGE MULTILAYER SERIES DESIGNATOR DEVICE SIZE: i.e., 120 mil x 60 mil (3mm x 1.5mm) PACKING OPTIONS (see Packaging section for quantities) T: 13in (330mm) Diameter Reel, Plastic Carrier Tape H: 7in (178mm) Diameter Reel, Plastic Carrier Tape R: 7in (178mm) Diameter Reel, Paper Carrier Tape END TERMINATION OPTION N: Nickel Barrier (Ni/Sn) CAPACITANCE OPTION No Letter: Standard L: Low Capacitance Version Packaging* Quantity Device Size 1206 13" Inch Reel 'T' Option) 10,000 10,000 10,000 0402 N/A N/A 7" Inch Reel ('H' Option) 7" Inch Reel ('R' Option) N/A N/A 4,000 10,000 N/A Bulk Pack ('A' Option) (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MLE.html for current information. 35 Revision: July 16, 2009 MLE Varistor Series MLE Series Surface Mount Multilayer Varistors (MLVs) > MLE Series Varistor Products Tape and Reel Specifications D0 P0 P2 E F K0 B0 For T and H Pack Options: PLASTIC CARRIER TAPE For R Pack Options: EMBOSSED PAPER CARRIER TAPE PRODUCT IDENTIFYING LABEL W t1 D1 P1 A0 EMBOSSMENT TOP TAPE 8mm NOMINAL 178mm OR 330mm DIA. REEL Symbol A0 B0 K0 W F E P1 P2 P0 D0 D1 T1 Top Tape Thickness Width of Cavity Length of Cavity Depth of Cavity Width of Tape Description Dimensions in Millimeters 0402 Size 0603, 0805 & 1206 Sizes Distance Between Drive Hole Centers and Cavity Centers Distance Between Drive Hole Centers and Tape Edge Distance Between Cavity Centers Axial Drive Distance Between Drive Hole Centers & Cavity Centers Axial Drive Distance Between Drive Hole Centers Drive Hole Diameter N/A 0.1 Max 0.1 Max MLE Varistor Series 36 Revision: July 16, 2009 (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/MLE.html for current information. |
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